SD Test Socket for Realizing Reading and Writing Data of Emmc BGA100 with Solder Ball

US$305.40
1-49 Pieces
US$280.20
50-99 Pieces
US$275.80
100+ Pieces
Port:
Shenzhen, China
Production Capacity:
20000PCS/Week
Payment Terms:
L/C, T/T, D/P, Western Union, Paypal, Money Gram

Sireda Technology Co., Ltd.

Guangdong, China

Last Login Date:

Oct 31, 2025

Main Products:

IC Test Socket, BGA Test Socket, BGA Test Adapter, Burn-in Socket, Semiconductor Test Connector, FFC FPC Test Jig, DDR4 DDR5 Test Fixture, Data Recovery, PGA Socket, Kelvin Socket

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Product Description

Company Info

Basic Info.

Model NO.
702-0000976
Contact
Pogo-Pin
OEM
Acceptable
Pitch Size
1.0mm
IC Size
14X18mm
Trademark
Sireda
Transport Package
Carton
Specification
BGA100
Origin
Shenzhen, China
HS Code
8536690000

Product Description

SD solution, eMMC BGA100 test adapter to SD Card / SD Adapter with solder ball


Applications
-- Test, debug, vakidation and programming of eMMC and eMCP devices
-- System and wafer test
-- Failure analysis
-- Package and chip qualification
-- Production prototype

Features
-- Suitable for eMMC and eMCP devices of Samsung, Hynix, Sandisk, Toshiba, Intel, Kinston, etc.
-- Suppor for various eMMC versions
-- Support hot plug, eMMC can be directly connected to PC with SD card reader
-- Realize reading, accessing and writing data for eMMC and eMCP devices
-- Socket clamp with rolling design makes it easy operation, less abration, so as to longer life span

Specifications
MechanicalSocket BodyPPS/Torlon
Socket LidAl

Contact

pogo-pin
Continous Operating Temperature-40ºC to 140ºC
Life Span at Operating Travel100 Cycles Min.
Spring Force27g/0.65mm per pin
ElectricalCurrent Rating(Continuous)2.59A
Self Inductiance1.57nH
Bandwidth @-1dB10GHz
DC Resistance42mohm/0.65mm


If you would like to know more about us, please have a look at our website: siredatech.en.made-in-china.com.
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