Basic Info.
Application
PCB, Communication, Integrated IC
Environmental Protection
General
Transport Package
Carton Box
Specification
eMMC Chip Reader
Product Description
eMCP to SD Adapter Chip Reader
The SD adapter chip reader is designed for application such as forensics, failure analysis, prototyping and other data recovery situation. it supports various eMMC or eMCP devices. the chip reader can be connected directly to PC with SD card reader.
FEATURES Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.
Support for eMMC version 5.0 or above.
Chip-off IC devices failure analysis, real time write-and-read in forensic application.
Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.
| Part Number | Device | Package | Size | Style | IC Chip Type |
| 702-0000899 | eMCP | BGA221 | 11.5X13mm | SD Interface | With solder ball |
| 702-0001037 | eMCP | BGA221 | 11.5X13mm | SD Interface | No solder ball |
Product Parameters
Mechanical |
Material Socket Body | PEEK Ceramic/PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | -0 ~ 80 ºC |
Life Span | 100K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical |
Current Rating | 2.59A |
DC Resistance | 42mohm@0.65mm |
Related Solution
USB Solution Chip Reader
- Suitable for eMMC, eMCP from Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston, etc.
- Support for eMMC version 5.0 or above
- Support for UFS version 2.2
- Chip-off IC devices failure analysis, real time write-and-read in forensic application.
- Support for hot plug, eMMC/eMCP can be directly connected to PC with USB and SD Port.
- USB version 3.0
Other Options for Socket Type
| Socket Type | Clamshell | Clamshell & Turning | Open Top | Patent F & F1 Solution |
| Photo | | | | |
| Max IC Size | 16 x 16mm | 30 x 30mm | 15 x 18mm | 32 x 32mm |
| Feature | 1) Suitable for device with around 100pins.
2) Designed for manual test like debug, validation, burn-in, failure test, etc.
3) Easy operation and less abrasion.
4) Highly cost-effective.
5) CNC alloy machined socket and PEI molded socket are available for choice. | 1) Ideal for lager device and device with numerous pogo-pins.
2) Suitable for manual test like debug, validation, burn-in, failure test, etc.
3) Clamshell and turning lock design offers good contact for devices.
4) Removable lid design provides both manual and automatic test options.
| 1) Suitable for various devices for burn-in and validation test.
2) Designed for automatic test.
3) Highly cost-effective.
4) Highly customized options available.
5) CNC alloy machined socket and PEI molded socket are available for choice.
| 1) F&F1 solutions are designed for devices for test, debug and validation.
2) Patented interposer w/ or w/o pinout aviod problems of pad co-planarity, oxidation and damage of the PCB board.
3) Removable lid design provides both manual and automatic test options.
4) No need to design a specific test PCB board and reduce total cost and turnaround time.
5) Patent socket.
|
| Link | Click here | Click here | Click here | Click here |
Product List
|
Part Number | Device | Package | Size | Style | IC Chip Type |
702-0000848 | eMMC | BGA153 | 11.5X13mm | SD Interface | With solder ball |
702-0000850 | eMMC | BGA153 | 11.5X13mm | SD Interface | No solder ball |
702-0001059 | eMMC | BGA153 | 11X10mm | SD Interface | With solder ball |
702-0001061 | eMMC | BGA153 | 11X10mm | SD Interface | No solder ball |
702-0001063 | eMMC | BGA169 | 12x16mm | SD Interface | With solder ball |
702-0001065 | eMMC | BGA169 | 12x16mm | SD Interface | No solder ball |
702-0001067 | eMMC | BGA169 | 12x18mm | SD Interface | With solder ball |
702-0001069 | eMMC | BGA169 | 12x18mm | SD Interface | No solder ball |
702-0001071 | eMMC | BGA169 | 14x18mm | SD Interface | With solder ball |
702-0001073 | eMMC | BGA169 | 14x18mm | SD Interface | No solder ball |
702-0000857 | eMCP | BGA162 | 11.5X13mm | SD Interface | With solder ball |
702-0000859 | eMCP | BGA162 | 11.5X13mm | SD Interface | No solder ball |
702-0000873 | eMCP | BGA162 | 12x13.5mm | SD Interface | With solder ball |
702-0000875 | eMCP | BGA162 | 12x13.5mm | SD Interface | No solder ball |
702-0000865 | eMCP | BGA186 | 12x16mm | SD Interface | With solder ball |
702-0000867 | eMCP | BGA186 | 12x16mm | SD Interface | No solder ball |
702-0000899 | eMCP | BGA221 | 11.5X13mm | SD Interface | With solder ball |
702-0001037 | eMCP | BGA221 | 11.5X13mm | SD Interface | No solder ball |
702-0001028 | eMCP | BGA254 | 11.5X13mm | SD Interface | With solder ball |
702-0001040 | eMCP | BGA254 | 11.5X13mm | SD Interface | No solder ball |
702-0001586 | eMCP | BGA254 | 12x15mm | SD Interface | No solder ball |
702-0000976 | eMMC | BGA100 | 14x18mm | SD Interface | With solder ball |
702-0001035 | eMMC | BGA100 | 14x18mm | SD Interface | No solder ball |
702-0001315 | eMMC | BGA136 | 10x10mm | SD Interface | No solder ball |
702-0001326 | eMMC | BGA136 | 10x10mm | SD Interface | With solder ball |
702-0000828 | eMCP | BGA529 | 15x15mm | SD Interface | With solder ball |
702-0000830 | eMCP | BGA529 | 15x15mm | SD Interface | No solder ball |
702-0001587 | eMCP | BGA280 | 14x14.5mm | SD Interface | No solder ball |
702-0001685 | eMMC | BGA153
BGA162
BGA221 | 3in1 | SD Interface | No solder ball |
For USB interface version test socket or other type of socket , please visit here . |
Why Choose Us
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents.
And also get the certificate of ISO9001:2015 & National High-tech.
Be the world's leading socket supplier
Creat value for our customer
To provide ground solutions that are well engineered, pramatic and innovative, using the specialist skills and experience for our team,
to meet and excced the expectations of our clients.
Pursue details, profession,efficiency, responsibility
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional
service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and
productivity.
Integrity, honesty and openness in everything we do
Recognising the vital importance of listening and valuing the opinion of others. Creating a fulfilling working enviroment where our people to
realise their potential.
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for
all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing,or reball kit.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized
design, shortest lead time, and most professional service.
As an IC testing socket supplier, we focus on Research and Innovations of Semiconductor Test with many Patents and ISO9001:2015
certification. We try our best to understand customer demand, as we always take customers as our business partner from the very beginning.
Our Partners
Address:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Service
Management System Certification:
ISO 9001
Company Introduction:
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing, or BGA reball stencil.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service for our customers all over the world. Work closely with customers and enable them to achieve greater manufacturing efficiency and productivity.
As an IC testing socket supplier, we focus on Semiconductor Test Research and Innovations, has Achieved a lot of Patents. And get certificate of National High-tech and ISO9001: 2015. Pursuing customer satisfaction is our main goal, we always take customers as our business partner from the very beginning. We try our best to understand demands of customers to provide best quality and service.
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