Basic Info.
Application
PCB, Communication, Integrated IC
Environmental Protection
General
Package
BGA, LGA, Qfn, Qfp, Wlcsp, Sop etc
Transport Package
Carton Box
Specification
Burn in Socket
Product Description
Burn in Socket
Burn-in socket is designed for cost-effective burn in, debug and validation test application, our test sockets are made with high quality material and electrial contact capable of meeting HAST and HALT test requirements to reliable and accurate test results.
FEATURES - Semi-custom clamshell socket solution suitable for BGA,
QFN, LGA package, etc. - Ideal for validation, burn in and other reliability test.
- Pitch starting from 0.35mm.
- Used for eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...
- Easy to close cover
>>> Product Specification
| Burn-in Socket |
| Pacakge | BGA, LGA, QFN |
| Number of Pins | 2~200 |
| Pitch | 0.35mm or above |
Mechanical |
Material Socket Body | PEI |
Material Socket Lid | PEI |
Contact | Pogo Pin |
Operation Temperature | -40 ~ 140 ºC |
Life Span | 50K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical |
Current Rating | 1.0A Min |
DC Resistance | Max. 100mΩ |
| Socket Type | Clamshell | Clamshell & Turning | Open Top | Patent F & F1 Solution |
| Photo | | | | |
| Max IC Size | 16 x 16mm | 30 x 30mm | 15 x 18mm | 32 x 32mm |
| Feature | 1) Suitable for device with around 100pins.
2) Designed for manual test like debug, validation, burn-in, failure test, etc.
3) Easy operation and less abrasion.
4) Highly cost-effective.
5) CNC alloy machined socket and PEI molded socket are available for choice. | 1) Ideal for lager device and device with numerous pogo-pins.
2) Suitable for manual test like debug, validation, burn-in, failure test, etc.
3) Clamshell and turning lock design offers good contact for devices.
4) Removable lid design provides both manual and automatic test options.
| 1) Suitable for various devices for burn-in and validation test.
2) Designed for automatic test.
3) Highly cost-effective.
4) Highly customized options available.
5) CNC alloy machined socket and PEI molded socket are available for choice.
| 1) F&F1 solutions are designed for devices for test, debug and validation.
2) Patented interposer w/ or w/o pinout aviod problems of pad co-planarity, oxidation and damage of the PCB board.
3) Removable lid design provides both manual and automatic test options.
4) No need to design a specific test PCB board and reduce total cost and turnaround time.
5) Patent socket.
|
| Link | Click here | Click here | Click here | Click here |
>>> "Buy and Use" Chip ReaderSD / USB Solution Chip Rearder
- Suitable for eMMC, eMCP from Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston, etc.
- Support for eMMC version 5.0 or above
- Support for UFS version 2.2
- Chip-off IC devices failure analysis, real time write-and-read in forensic application.
- Support for hot plug, eMMC/eMCP can be directly connected to PC with USB and SD Port.
- USB version 3.0
>>> Application Examples PRODUCT LIST
List of Some Burn-in Sockets
| Part Number | Package | Description | Socket Type |
| 711-0000001 | BGA153 | BGA153 0.5mm eMMC OT101 11.5x13mm | Open Top |
| 711-0000002 | BGA152 | BGA152 1.0mm Nand OT102 14x18mm | Open Top |
| 711-0000004 | BGA153 | BGA153 0.5mm eMMC OT101 7.5x12.5mm | Open Top |
| 711-0000005 | QFN8 | QFN8 1.27mm OT101 6x8mm | Open Top |
| 711-0000006 | BGA153 | BGA153 0.5mm UFS OT101 11.5x13mm | Open Top |
| 701-0000041 | BGA162 | BGA162 0.5mm eMCP CS100 11.5x13mm | Clamshell |
| 701-0000048 | BGA221 | BGA221 0.5mm eMCP CS100 11.5x13mm | Clamshell |
| 701-0000049 | BGA152 | BGA152 1.0mm Nand CS100 14x18mm | Clamshell |
| 701-0000050 | BGA153 | BGA153 0.5mm eMMC CS100 11.5x13mm | Clamshell |
| 701-0000051 | BGA132 | BGA132 1.0mm Nand CS100 12x18mm | Clamshell |
| 701-0000063 | MicroSD | 8PIN 1.1mm MicroSD Card CS100 11x15mm | Clamshell |
| 701-0000065 | BGA63 | BGA63 0.8mm Nand CS100 9x11mm | Clamshell |
| 701-0000066 | BGA136 | BGA136 0.5mm eMCP CS100 10x10mm | Clamshell |
| 701-0000068 | BGA153 | BGA153 0.5mm UFS CS100 11.5x13mm DIP48 | Clamshell |
| 701-0000070 | BGA153 | BGA153 0.5mm eMMC CS100 11.5x13mm DIP48 | Clamshell |
| 701-0000071 | TF card | LGA8 1.475mm nMMC CS100 8.8x12.3mm | Clamshell |
| 701-0000077 | BGA254 | BGA254 0.5mm eMCP CS100 11.5x13mm | Clamshell |
| 701-0000099 | LGA60 | LGA60 1.0mm E2Nand CS100 12x17mm | Clamshell |
| 701-0000101 | MicroSD | 17PIN 0.76mm MicroSD Card CS100 11x15mm | Clamshell |
| 701-0000102 | BGA162 | BGA162 0.5mm ESMT nMCP CS100 8x10.5mm | Clamshell |
| 701-0000107 | BGA130 | BGA130 0.65mm DDR CS100 8.0x9.0mm | Clamshell |
| 701-0000120 | BGA162 | BGA162 0.5mm DDR2 CS100 8x10.5mm | Clamshell |
| 701-0000121 | BGA254 | BGA254 0.5mm uMCP CS100 11.5x13mm | Clamshell |
| 701-0000127 | BGA153 | BGA153 0.5mm eMMC CS100 9x10mm | Clamshell |
| 701-0000134 | BGA153 | BGA153 0.5mm eMMC CS100 9x7.5mm | Clamshell |
| 701-0000153 | BGA153 | BGA153 0.5mm eMMC CS100 7.5x9mm | Clamshell |
| 701-0000157 | BGA153 | BGA153 0.5mm eMMC CS100 11.5x13mm | Clamshell |
| 701-0000159 | BGA168 | BGA168 0.5mm eMCP 12x12mm | Clamshell |
| 701-0000163 | BGA153 | BGA153 0.5mm UFS CS100 11.5x13mm | Clamshell |
| 701-0000164 | BGA100 | BGA100 1.0mm CS100 14x18mm | Clamshell |
| 701-0000214 | BGA320 | BGA320 0.4mm CS100 12x13mm | Clamshell |
| >>Not all sockets listed in this list, please contact us for more IC test sockets or customize a socket to fit your own application. |
WHY CHOOSE US
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents.
And also get the certificate of ISO9001:2015 & National High-tech.
Be the world's leading socket supplier
Creat value for our customer
To provide ground solutions that are well engineered, pramatic and innovative, using the specialist skills and experience for our team,
to meet and excced the expectations of our clients.
Pursue details, profession,efficiency, responsibility
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional
service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and
productivity.
Integrity, honesty and openness in everything we do
Recognising the vital importance of listening and valuing the opinion of others. Creating a fulfilling working enviroment where our people to
realise their potential.
COMPANY PROFILE
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for
all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing,or reball kit.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized
design, shortest lead time, and most professional service.
As an IC testing socket supplier, we focus on Research and Innovations of Semiconductor Test with many Patents and ISO9001:2015
certification. We try our best to understand customer demand, as we always take customers as our business partner from the very beginning.
OUR PARTNERS
CERTIFICATIONS
Address:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Service
Management System Certification:
ISO 9001
Company Introduction:
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing, or BGA reball stencil.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service for our customers all over the world. Work closely with customers and enable them to achieve greater manufacturing efficiency and productivity.
As an IC testing socket supplier, we focus on Semiconductor Test Research and Innovations, has Achieved a lot of Patents. And get certificate of National High-tech and ISO9001: 2015. Pursuing customer satisfaction is our main goal, we always take customers as our business partner from the very beginning. We try our best to understand demands of customers to provide best quality and service.
){kind=link}