Basic Info.
Application
PCB, Computer, Communication, Mobile Phone, Integrated IC
Environmental Protection
General
Connection Mode
Card Lock Connection
Contact Termination Form
Screws Fixed
Character
Environmental Protection
Interface Type
SD Interface
IC Chip Type
Without Solder Ball
Product Description
Product Description
eMCP BGA254 Test socket
1. Applicable for eMMC,eMCP devices from Samsung, Hynix, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.
2. Support for eMMC version 5.0 or above.
3. Chip-off IC devices failure analysis, real time write-and-read in forensic application.
4. Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.
Product Parameters
Mechanical |
Material Socket Body | Torlon/PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | -0 ~ 80 ºC |
Life Span | 50K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical |
Current Rating | 2.59A |
DC Resistance | 42mΩ@0.65mm |
Specification
eMCP BGA254(702-0001040)
IC Size: 11.5x13mm
Solder Ball: without solder ball
Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part Number | Description | IC Chip Type |
702-0000857 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0000859 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000873 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BA | With solder ball |
702-0000875 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NB | Without solder ball |
702-0000865 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA | With solder ball |
702-0000867 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB | Without solder ball |
702-0000899 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001037 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000976 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
702-0001035 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
702-0001315 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 NB | Without solder ball |
702-0001326 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 BA | With solder ball |
702-0000828 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 BA | With solder ball |
702-0000830 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001586 | BGA254 0.5mm eMCP CS125 12x15mm SD B0 NB | Without solder ball |
702-0001587 | BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NB | Without solder ball |
702-0001685 | BGA153+162+221 0.5mm CS125 3 in1 SD B0 NB | Without solder ball |
Company Profile
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
Be the world's leading socket supplierAs an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
Create value for our customersWe are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
Our Advantages
No MOQ | No MOQ limitation here. Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
High Cost Performance | We provide products with high quality and competitive price. |
Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience. So we have the ability to design and produce best products according to our customers' requirements. |
Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale. Strictly quality control is in each production process. Our team are keep helping our customers to solve their problems anytime if needed. |
Contact US
| Shenzhen Sireda Technology Co., Ltd. |
Add | Area A,Floor 6, Building 4, the 10th Industry Park, GuangMing District,Shenzhen 518132 |
We provide products with good quality and fast response, also provide customized service. If you have any questions, please feel free to send us inquiry. Thank you! |
Address:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Service
Management System Certification:
ISO 9001
Company Introduction:
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing, or BGA reball stencil.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service for our customers all over the world. Work closely with customers and enable them to achieve greater manufacturing efficiency and productivity.
As an IC testing socket supplier, we focus on Semiconductor Test Research and Innovations, has Achieved a lot of Patents. And get certificate of National High-tech and ISO9001: 2015. Pursuing customer satisfaction is our main goal, we always take customers as our business partner from the very beginning. We try our best to understand demands of customers to provide best quality and service.