Basic Info.
Application
PCB, Computer, Communication, Mobile Phone, Integrated IC
Environmental Protection
General
Connection Mode
Card Lock Connection
Contact Termination Form
Screws Fixed
Character
Environmental Protection
Transportation
FedEx/UPS/DHL Acceptable
Material Socket Body
Peek Ceramic
Spring Force
20g ~ 30g Per Pin
Product Description
Product Description
F Interposer Characteristics
Usually, there will be some residual solder with the pads on customer's main board or test board when a DUT IC chip is removed from the PCB board. This leads to problems of bad pads co-planarity, oxidation, so as to poor contact or even damages of PCB board when testing using a socket directly connecting to the PCB board.
Sireda's patented F Solution with F Interposer helps to fix the problem. F Interposer, as a bridge, which connects customer main board to Sireda test socket, brings customer big convenience and cost saving as well. For different applications of the same device (like eMMC 153), customer only needs to change a new interposer and take use of the same socket for test.
BGA153 eMMC Test Socket with F interposer
• F Solution is designed for fast validation & test of IC chip like eMMC, DRAM, eMCP, UFS, FLASH, LPDDR3, LPDD4, and CPU as well.
• Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after de-soldering.
• The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board cost.
• "Buy and use" design and with fully removable double latch turning lid bring customers big convenience.
• Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.
• Customized interposer development.
• The F1 interposer is with some pinout based on F interposer, providing signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an oscilloscope. For more details, please refer to our F1 solution.
Product Parameters
| Mechanical |
| Material Socket Body | Peek Ceramic |
| Material Socket Lid | AL, Cu, POM |
| Contact | Pogo Pin |
| Operation Temperature | -40 ~ 140 ºC |
| Life Span | 50K Cycles |
| Spring Force | 20g ~ 30g per Pin |
| Electrical |
| Current Rating | 1.0 ~ 2.0A |
| DC Resistance | Max. 100mΩ |
Application Example
Solder the Interposer onto mainboard,screw socket to the interposer, and insert the device to be tested, place and lock the lid, then screw down the heat sink actuator for device engagement. Now it is ready for use.
Advantages with F solution are convenience,high efficiency,compact structure,cost-effective, is called kind of "buy and use" modular.
Main applications are for test, debug and validation of devices of BGA, LGA, QFP, QFN, SOP used on smart phone, tablet PC, wearable devices, Internet of things, TV board, etc.
A lot of F solutions have been provided to our customers for their memory IC chips like eMMC, eMCP, FLASH, DDR, UFS and CPU devices as well.
Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website:
siredatech.en.made-in-china.com.
| Part Number | Name | Description | Package |
| 702-0000159 | F Solution | BGA153 0.5mm eMMC DT100 11.5x13mm F A | BGA153 |
| 702-0000175 | F Solution | BGA221 0.5mm eMCP DT100 11.5x13mm F A | BGA221 |
| 702-0000176 | F Solution | BGA63 0.8mm DT100 9x11mm F A | BGA63 |
| 702-0000177 | F Solution | BGA168 0.5mm LPDDR DT100 12x12mm F A | BGA168 |
| 702-0000181 | F Solution | BGA78 0.8mm DDR DT100 10.5x12mm F A | BGA78 |
| 702-0000185 | F Solution | BGA96 0.8mm DDR DT100 9x14mm F A | BGA96 |
| 702-0000186 | F Solution | BGA96 0.8mm DDR DT100 9x13mm F A | BGA96 |
| 702-0000187 | F Solution | BGA78 0.8mm DDR DT100 9x10.5mm F A | BGA78 |
| 702-0000188 | F Solution | BGA78 0.8mm DDR DT100 9x11.1mm F A | BGA78 |
| 702-0000189 | F Solution | BGA84 0.8mm DDR DT100 8x12.5mm F A | BGA84 |
| 702-0000203 | F Solution | BGA153 0.5mm eMMC DT100 10x11mm F A | BGA153 |
| 702-0000204 | F Solution | BGA169 0.5mm eMMC DT100 12x16mm F A | BGA169 |
| 702-0000205 | F Solution | BGA169 0.5mm eMMC DT100 12x18mm F A | BGA169 |
| 702-0000206 | F Solution | BGA169 0.5mm eMMC DT100 14x18mm F A | BGA169 |
| 702-0000207 | F Solution | BGA162 0.5mm eMCP DT100 11.5x13mm F A | BGA162 |
| 702-0000210 | F Solution | BGA216 0.4mm DT100 12x12mm F A | BGA216 |
| 702-0000211 | F Solution | BGA134 0.65mm DT100 10x11.5mm F A | BGA134 |
| 702-0000212 | F Solution | BGA107 0.8mm DT100 10.47x12.99mm F A | BGA107 |
| 702-0000213 | F Solution | BGA107 0.8mm DT100 11.5x13mm F A | BGA107 |
| 702-0000215 | F Solution | BGA63 0.8mm DT100 9.5x12mm F A | BGA63 |
| 702-0000216 | F Solution | BGA96 0.8mm DDR DT100 10x14mm F A | BGA96 |
| 702-0000217 | F Solution | BGA130 0.65mm MCP DT100 8x9mm F A | BGA130 |
| 702-0000218 | F Solution | BGA100 1.0mm Nand DT100 14x18mm F A | BGA100 |
| 702-0000219 | F Solution | BGA152 1.0mm Nand DT100 14x18mm F A | BGA152 |
| 702-0000220 | F Solution | BGA132 1.0mm Nand DT100 12x18mm F A | BGA132 |
| 702-0000221 | F Solution | BGA136 1.0mm Nand DT100 14x16.5mm F A | BGA136 |
| 702-0000225 | F Solution | LGA60 1.41mm Nand DT100 11x14mm F A | LGA60 |
| 702-0000226 | F Solution | LGA60 1.41mm Nand DT100 12x17mm F A | LGA60 |
| 702-0000227 | F Solution | LGA52 1.41mm Nand DT200 12x20mm F A | LGA52 |
| 702-0000229 | F Solution | LGA60 1.41mm Nand DT100 13x18mm F A | LGA60 |
| 702-0000230 | F Solution | LGA52 1.41mm Nand DT100 14x18mm F A | LGA52 |
| 702-0000233 | F Solution | BGA96 0.8mm DDR DT100 9x13mm F A | BGA96 |
| 702-0000240 | F Solution | BGA78 0.8mm DDR DT100 7.5x11mm F A | BGA78 |
| 702-0000244 | F Solution | BGA78 0.8mm DDR DT100 8x10.5mm F A | BGA78 |
| 702-0000249 | F Solution | BGA78 0.8mm DDR DT100 9x10.6mm F A | BGA78 |
| 702-0000251 | F Solution | BGA78 0.8mm DDR DT100 9x11.5mm F A | BGA78 |
| 702-0000255 | F Solution | BGA78 0.8mm DDR DT100 9.4x11.1mm F A | BGA78 |
| 702-0000258 | F Solution | BGA78 0.8mm DDR DT100 10x11mm F A | BGA78 |
| 702-0000262 | F Solution | BGA144 0.8mm DRAM DT100 11x18.5mm F A | BGA144 |
| 702-0000266 | F Solution | BGA95 0.65mm UFS DT100 11.5x13mm F A | BGA95 |
| 702-0000267 | F Solution | BGA96 0.8mm DDR DT100 7.5x13mm F A | BGA96 |
| 702-0000268 | F Solution | BGA96 0.8mm DDR DT100 7.5x13.3mm F A | BGA96 |
| 702-0000277 | F Solution | BGA96 0.8mm DDR DT100 9.4x13mm F A | BGA96 |
| 702-0000278 | F Solution | BGA96 0.8mm DDR DT100 10x13.3mm F A | BGA96 |
| 702-0000280 | F Solution | BGA96 0.8mm DDR DT100 11x13.3mm F A | BGA96 |
| 702-0000281 | F Solution | BGA170 0.8mm DDR DT100 12x14mm F A | BGA170 |
| 702-0000282 | F Solution | BGA136 0.8mmDDR DT100 10x14mm F A | BGA136 |
| 702-0000283 | F Solution | BGA136 0.8mmDDR DT100 11x14mm F A | BGA136 |
| 702-0000284 | F Solution | BGA136 0.8mmDDR DT100 12x14mm F A | BGA136 |
| 702-0000285 | F Solution | BGA137 0.8mm MCP DT100 10.5x13mm F A | BGA137 |
| 702-0000286 | F Solution | BGA137 0.8mm MCP DT100 11.5x13mm F A | BGA137 |
| 702-0000295 | F Solution | BGA88 0.8mm DT100 8x10mm F A | BGA88 |
| 702-0000297 | F Solution | BGA88 0.8mm DT100 11x11mm F A | BGA88 |
| 702-0000298 | F Solution | BGA88 0.8mm DT100 8x11.6mm F A | BGA88 |
| 702-0000325 | F Solution | BGA136 0.8mm eMCP DT100 10.5x13mm F A | BGA136 |
| 702-0000418 | F Solution | BGA178 0.65mm LPDDR DT100 11x11.5mm F A | BGA178 |
| 702-0000627 | F Solution | TSOP48 0.5mm Nand DT100 12x20mm F A | TSOP48 |
| 702-0000666 | F Solution | QFP256 0.4mm DT125 28x28mm F A | QFP256 |
| 702-0000667 | F Solution | QFP176 0.4mm DT100 20x20mm F A | QFP176 |
| 702-0000671 | F Solution | QFN88 0.5mm BF504F CS 12x12mm | QFN88 |
| 702-0000725 | F Solution | BGA96 0.8mm DDR DT100 7.5x13.5mm F A | BGA96 |
| 702-0000743 | F Solution | LGA118 2.0mm RF module CT 27.2x25.2mm | LGA118 |
| 702-0000842 | F Solution | BGA168 0.5mm LPDDR DT100 12x12mm F A | BGA168 |
| 702-0000945 | F Solution | BGA169 0.5mm eMMC DT100 12x16mm F A | BGA169 |
| 702-0000949 | F Solution | BGA132 1.0mm Nand DT100 12x18mm F A | BGA132 |
| 702-0001074 | F Solution | BGA100 1.0mm eMMC DT100 14x18mm F A NB | BGA100 |
| 702-0001075 | F Solution | BGA100 1.0mm eMMC DT100 14x18mm F A BA | BGA100 |
| 702-0001076 | F Solution | BGA78 0.8mm DDR DT100 8x12mm F A | BGA78 |
| 702-0001149 | F Solution | BGA254 0.5mm eMCP DT100 11.5x13mm F A | BGA254 |
Company Profile
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.
Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
Create value for our customersWe are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
Certifications
Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Sireda has been authorized as National High Technology Expertise.Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.
Sireda is highly recognized by industry professionals as a company with growth potential.
Our Advantages
| No MOQ | No MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
| High Cost Performance | We provide products with high quality and competitive price. |
| Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements. |
| Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed. |
Our Exhibition and Customers
Address:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Service
Management System Certification:
ISO 9001
Company Introduction:
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing, or BGA reball stencil.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service for our customers all over the world. Work closely with customers and enable them to achieve greater manufacturing efficiency and productivity.
As an IC testing socket supplier, we focus on Semiconductor Test Research and Innovations, has Achieved a lot of Patents. And get certificate of National High-tech and ISO9001: 2015. Pursuing customer satisfaction is our main goal, we always take customers as our business partner from the very beginning. We try our best to understand demands of customers to provide best quality and service.
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