Basic Info.
Application
PCB, Computer, Communication, Mobile Phone, Integrated IC
Environmental Protection
General
Connection Mode
Card Lock Connection
Contact Termination Form
Screws Fixed
Character
Environmental Protection
Interface Type
SD Adapter
Payment Method
100% T/T in Advance
Transportation
FedEx/UPS/DHL Acceptable
IC Chip Type
Without Solder Ball
Customized Operation Temperature
-40 ~ 140 ºC
Spring Force
20g ~ 30g Per Pin
Product Description
1. Product DescriptionBGA169 eMMC SD adapter test socket 12x18mm for chipoff data recovery and forensic Part Number: 702-0001069SD adapter is designed for data reading and writing with SD adapter to a PC. Mostly SD adapter is used in areas of data recovery, mobile device forensics to realize reading, accessing and writing data of eMMC and eMCP devices from Samsung, Hynix, SanDisk, Toshiba, Intel, Kingston, etc.2. Features - Applicable for eMMC, eMCP devices from Samsung, Hynix, SanDisk, Toshiba, Kingston, Intel, etc., including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.
- Support for eMMC version 5.0 or above.
- Chip-off IC devices failure analysis.
- Real time write-and-read in forensic application.
- Support for hot plug, eMMC/eMCP can be directly connected to PC with SD adapter.
3. Parameters| Mechanical |
| Material Socket Body | PPS |
| Material Socket Lid | AL, Cu, PEI |
| Contact | Pogo Pin |
| Operation Temperature | 0 ~ 80 ºC |
| Life Span | 50K Cycles |
| Spring Force | 20g ~ 30g per Pin |
| Electrical |
| Current Rating | 1.0A~2.0A |
| DC Resistance | Max. 100mΩ |
(702-0001069)
IC Size: 12x18mm
Package: BGA169 without solder balls
5. Relative ProductsHere it only shows a selection of sockets, for customized or other type, please have look at our website:
siredatech.en.made-in-china.com.
| Part Number | Description | IC Chip Type |
| 702-0000848 | BGA153 0.5mm eMMC CS125 11.5X13mm SD B0 BA | With solder ball |
| 702-0000850 | BGA153 0.5mm eMMC CS125 11.5X13mm SD B0 NB | Without solder ball |
| 702-0001059 | BGA153 0.5mm eMMC CS125 11x10mm SD B0 BA | With solder ball |
| 702-0001061 | BGA153 0.5mm eMMC CS125 11x10mm SD B0 NB | Without solder ball |
| 702-0001063 | BGA169 0.5mm eMMC CS125 12x16mm SD B0 BA | With solder ball |
| 702-0001065 | BGA169 0.5mm eMMC CS125 12x16mm SD B0 NB | Without solder ball |
| 702-0001067 | BGA169 0.5mm eMMC CS125 12x18mm SD B0 BA | With solder ball |
| 702-0001069 | BGA169 0.5mm eMMC CS125 12x18mm SD B0 NB | Without solder ball |
| 702-0001071 | BGA169 0.5mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
| 702-0001073 | BGA169 0.5mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
| 702-0000857 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
| 702-0000859 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
| 702-0000873 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BA | With solder ball |
| 702-0000875 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NB | Without solder ball |
| 702-0000865 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA | With solder ball |
| 702-0000867 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB | Without solder ball |
| 702-0000899 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
| 702-0001037 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
| 702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
| 702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
| 702-0000976 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
| 702-0001035 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
| 702-0001315 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 NB | Without solder ball |
| 702-0001326 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 BA | With solder ball |
| 702-0000828 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 BA | With solder ball |
| 702-0000830 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 NB | Without solder ball |
| 702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
| 702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
| 702-0001586 | BGA254 0.5mm eMCP CS125 12x15mm SD B0 NB | Without solder ball |
| 702-0001587 | BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NB | Without solder ball |
| 702-0001685 | BGA153+162+221 0.5mm CS125 3 in1 SD B0 NB | Without solder ball |
Company Profile
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.
Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
Create value for our customersWe are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
Certifications
Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Sireda has been authorized as National High Technology Expertise.Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.
Sireda is highly recognized by industry professionals as a company with growth potential.
Our Advantages
| No MOQ | No MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
| High Cost Performance | We provide products with high quality and competitive price. |
| Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements. |
| Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed. |
Our Exhibition and Customers
Address:
a Area, Floor6, Building 4, Hanhaida High-Tech Park, The Tenth Industry Estate, Gongming Tianliao, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Service
Management System Certification:
ISO 9001
Company Introduction:
Sireda Technology Co., Ltd was established in 2010. We specialize in the manufacture of semiconductor test socket and test fixtures for all kinds of semiconductor IC like CPU, Memory, Power Supply, MCU, RF, etc. We also provide BGA IC rework, reballing, or BGA reball stencil.
With advanced knowledge and technologies, Sireda is committed to providing the most competitive prices, highest quality, best customized design, shortest lead time, and most professional service for our customers all over the world. Work closely with customers and enable them to achieve greater manufacturing efficiency and productivity.
As an IC testing socket supplier, we focus on Semiconductor Test Research and Innovations, has Achieved a lot of Patents. And get certificate of National High-tech and ISO9001: 2015. Pursuing customer satisfaction is our main goal, we always take customers as our business partner from the very beginning. We try our best to understand demands of customers to provide best quality and service.
){kind=link}