Guangdong, China
Business Type:
Manufacturer/Factory & Trading Company
Registered Capital:
443406.54 USD
Plant Area:
1600 square meters
Management System Certification:
ISO9001:2015
Average Lead Time:
Peak season lead time: within 15 workdays
Off season lead time: within 15 workdays
OEM/ODM Service
Sample Available

Emcp BGA162 SD Adapter, BGA Socket, Emcp Socket with Solder Ball manufacturer / supplier in China, offering Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm, Burn in Test Socket Molded Nand BGA132, Emmc BGA132 Nand Socket 12X18mm Molded Adapter and so on.

Gold Member Since 2020
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Supplier Homepage Products Terminal Blocks Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
  • Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Purchase Qty. / Reference FOB Price
1-49 Pieces US $315.4
50-99 Pieces US $298.3
100+ Pieces US $275.8
Port: Shenzhen, China
Production Capacity: 2000PCS/Month
Payment Terms: L/C, T/T, D/P, Western Union, Paypal, Money Gram
Application: PCB, Computer, Communication, Mobile Phone, Integrated IC
Environmental Protection: General
Connection Mode: Card Lock Connection
Shape: Rectangle
Contact Termination Form: Screws Fixed
Type: IC Socket

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Basic Info.

Model NO.
702-0000857
Character
Environmental Protection
Production Process
CNC
Interface Type
SD Interface
Brand
Sireda
Pin Count
162
Pitch
0.5mm
Contact
Spring Probe
Package
BGA
IC Size
11.5X13mm
Trademark
Sireda
Transport Package
Carton
Specification
BGA162
Origin
Shenzhen, China
HS Code
8536690000
  • Product Description
  • Product Parameters
  • Specification
  • Relative Products
  • Company Profile
  • Certifications
  • Our Advantages
  • Our Exhibition and Customers
Product Description
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
eMCP BGA162 Test socket
 
1. Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529. 

2. Support for eMMC version 5.0 or above.

3. Chip-off IC devices failure analysis, real time write-and-read in forensic application.

4. Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.

 

Product Parameters
Mechanical
Material Socket BodyTorlon/PPS
Material Socket LidAL, POM
ContactPogo Pin
Operation Temperature-0 ~ 80 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin
Electrical
Current Rating2.59A
DC Resistance42mΩ@0.65mm
 
Specification
eMCP BGA162(702-0000857)
 
IC Size: 11.5X13mm
Solder Ball: with solder ball
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

 

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

 
Relative Products

Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.

Part NumberDescriptionIC Chip Type
702-0000857BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0000859BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0000873BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BAWith solder ball
702-0000875BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NBWithout solder ball
702-0000865BGA186 0.5mm eMCP CS125 12x16mm SD B0 BAWith solder ball
702-0000867BGA186 0.5mm eMCP CS125 12x16mm SD B0 NBWithout solder ball
702-0000899BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0001037BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0001028BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0001040BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0000976BGA100 1.0mm eMMC CS125 14x18mm SD B0 BAWith solder ball
702-0001035BGA100 1.0mm eMMC CS125 14x18mm SD B0 NBWithout solder ball
702-0001315BGA136 0.5mm eMMC CS125 10x10mm SD  B0 NBWithout solder ball
702-0001326BGA136 0.5mm eMMC CS125 10x10mm SD B0 BAWith solder ball
702-0000828BGA529 0.5mm eMCP CS125 15x15mm SD B0 BAWith solder ball
702-0000830BGA529 0.5mm eMCP CS125 15x15mm SD B0 NBWithout solder ball
702-0001028BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0001040BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0001586BGA254 0.5mm eMCP CS125 12x15mm SD B0 NBWithout solder ball
702-0001587BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NBWithout solder ball
702-0001685BGA153+162+221 0.5mm CS125 3 in1 SD B0 NBWithout solder ball


 
Company Profile

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm

Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.

Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.

 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm
Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Emcp Test Socket with SD Interface BGA162 with Solder Ball 11.5X13mm



 

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